Home Components Hardware Boards Books Kits
Futurlec - The Electronic Components and Semiconductor Superstore
 Search
Order Status Order Status

Corporate

dotAbout Us
dotDelivery
dotGuarantee

Services

dotPCB Manufacture
dotPCB Design
dotBoard Assembly

Need Help

dotContact Us
dotNews
dotLatest Products
dotOrdering Information

Hello. Welcome to Futurlec. The ELECTRONIC COMPONENTS Superstore. To find the component your looking for, either search by Part Number or visit the relative department. Need Help.


TOP STORIES


New IR Temperature Measurement Device for Consumer Electronics


Industry's first single-chip IR MEMS temperature sensor will enable new user apps, device features


TI New IR Temperature Measurement Texas Instruments is enabling contactless temperature measurement for the first time in portable consumer electronics with the industry's first single-chip passive infrared (IR) MEMS temperature sensor. The TMP006 digital temperature sensor provides manufacturers of mobile devices, such as smartphones, tablets and notebooks, with the ability to accurately measure device case temperature using IR technology. This advancement over the current approach of approximating case temperature based on system temperature will enable system designers to optimize performance while providing a more comfortable user experience. The TMP006 can also be used to measure temperature outside the device, enabling new features and user applications.

“The TMP006 solves our customers' need for advanced thermal management of processors, and allows for optimizing system performance and safety even as processing power increases and form factors continue to shrink,” said Steve Anderson, senior vice president of TI's High Performance Analog business. “And with the TMP006, for the first time mobile device manufacturers will be able to measure the temperature of objects outside the phone, which will unleash an entirely new functionality for apps developers to creatively tap into.”

The TMP006 is the most highly-integrated device of its kind. It integrates an on-chip MEMS thermopile sensor, signal conditioning, a 16-bit analog-to-digital-converter (ADC), local temperature sensor and voltage references on a single 1.6-mm x 1.6-mm chip. It provides a complete digital solution for contactless temperature measurement that is 95 percent smaller than any other thermopile sensor.

Key Features

  • Integrates MEMS sensor with supporting analog circuitry, reducing solution size 95 percent compared to the competition.
  • Uses only 240 µA quiescent current and 1 µA in shutdown mode - 90 percent less power than competitive solutions.
  • Supports a wide temperature range of -40 degrees to +125 degrees Celsius with an accuracy of +/- 0.5 degree C (typical) on the local sensor and accuracy of +/- 1 degrees C (typical) for the passive IR sensor.
  • Includes I2C/SMBus digital interface.

The company's Web site address is www.ti.com
[Reprinted with kind permission from Texas Instruments]


Headlines

arrowAnalog Devices and Linear Technology to Combine

arrowNew MEMS Switch Technology

arrowNew Microcontroller with 256KB FRAM Memory

arrowQualcomm To Acquire NXP

arrowNew ST Low-Power, Long-Range Radio Chip

arrowMicrochip Releases New AVR Microcontrollers

Other Stories

arrowNew STM8 C-Compiler

arrowMicrochip to Acquire Atmel

arrowNew Time-of-Flight IC with Object Detection

arrowNXP Release Automotive Ethernet Solutions

arrowNew Galvanic Skin Response Design

arrowMicrochip Releases JukeBlox® 4 Platform

arrowNew 2-Pin Self-Powered Serial EEPROM

arrowNXP and Freescale Announce Merger

arrowMicrochip's New Motion Module

arrowNew Heads-up Swimming Monitor

arrow New Ultrasonic Flow Meter Design

arrowLinear Technology's New Power Monitoring IC

arrowNew Multi-Tuner Car-Radio IC from STMicroelectronics

arrowAtmel Release New ATmega Microcontrollers

arrowNew Low-Cost PIC32 Microcontrollers

arrowNew MPLAB Harmony Firmware from Microchip

arrowAtmel Release Studio 6.2 IDE

arrowNew High Accuracy Pressure Sensor

arrowNew Smart Meter IC from Microchip

arrowDynamic NFC Tags for Comsumer Appliances

arrowNew Floating Switch Architecture for LED Lighting

arrowNew Power Monitoring IC from Microchip

arrowSTMicroelectronics Releases Unique HomePlug Smart System-on-Chip

arrowAnalog Devices Release New Mixed-Signal ARM-M4 Processor

arrowNew Wireless Power Chip for Qi Charging Stations

arrowHigh-Performance Single-Chip AM/FM Radio Tuners

arrowNew Flourescent Ballast Control IC

arrowNew Ultra-Wideband High Linearity Mixer

arrowNew Near Field Communication Tags

arrowNew Freescale 5V 32-bit ARM Cortex-M0 MPUs

arrowNew DockPort Solution Enables Video, USB and Power Over a Single Cable

arrowWorld's Smallest e-Compass Module

arrowNew Class-AB Audio Amplifers from NXP

arrowTI Releases Li-Ion Battery Fast Charge Chipset

arrowNew Atmel Cortex-A5 MPU Loaded with Features

arrowNew Sound Chip Delivers Excellent Sound Quality

arrowNew PIC Microcontrollers with Integrated Op-Amps

arrowMicrochip Releases New High Density 1Mbit Serial SRAM

arrowNew e-Compass Module with Motion and Magnetic Sensors

arrowMicrochip Releases New USB PIC® Microcontrollers

arrowRevolutionary New Audio IC Delivers 5 Times the Power

arrowNew Atmel ARM Cortex-M4 Microcontroller

arrowNew Fully Integrated Ultrasonic Signal Conditioner

arrowNew Java Design Platform for STM32 Microcontrollers

arrowNXP Adds New GreenChip IC for Use With Mains LED Lighting

arrowMicrochip Releases Improved C Compiler for PIC Microcontrollers

arrowNew Atmel Studio 6 Release with Support for ARM Microcontrollers

arrowFreescale Releases New Kinetis Microcontrollers with 16-bit ADC

arrowNew Low-Voltage Digital Thermometers/Thermostats from Maxim

arrowNXP Adds New Low Power ARM Microcontrollers

arrowAnalog Devices New MEMS Accelerometers




How To Order  |  What's New  |  Your Account  |  Order Status  |  Help

About Us  |  Contact Us

Copyright Information © 2016, Futurlec